JPS6223674B2 - - Google Patents
Info
- Publication number
- JPS6223674B2 JPS6223674B2 JP56158806A JP15880681A JPS6223674B2 JP S6223674 B2 JPS6223674 B2 JP S6223674B2 JP 56158806 A JP56158806 A JP 56158806A JP 15880681 A JP15880681 A JP 15880681A JP S6223674 B2 JPS6223674 B2 JP S6223674B2
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- semiconductor
- protective film
- heating element
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15880681A JPS5859863A (ja) | 1981-10-07 | 1981-10-07 | サ−マルヘツド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15880681A JPS5859863A (ja) | 1981-10-07 | 1981-10-07 | サ−マルヘツド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5859863A JPS5859863A (ja) | 1983-04-09 |
JPS6223674B2 true JPS6223674B2 (en]) | 1987-05-25 |
Family
ID=15679759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15880681A Granted JPS5859863A (ja) | 1981-10-07 | 1981-10-07 | サ−マルヘツド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5859863A (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD532269S1 (en) | 2005-02-02 | 2006-11-21 | Perry Kaye | Scissors |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS605841U (ja) * | 1983-06-11 | 1985-01-16 | ロ−ム株式会社 | 熱印字ヘツド |
JPS60152439U (ja) * | 1984-03-21 | 1985-10-11 | ロ−ム株式会社 | サ−マルプリントヘツド |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53872A (en) * | 1976-06-24 | 1978-01-07 | Yokoyama Teruo | Gas breaker controller |
JPS5952073B2 (ja) * | 1977-01-12 | 1984-12-18 | 株式会社東芝 | ダイオ−ドマトリクス一体化感熱ヘツド |
JPS5421854A (en) * | 1977-07-20 | 1979-02-19 | Toshiba Corp | Recording head |
-
1981
- 1981-10-07 JP JP15880681A patent/JPS5859863A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD532269S1 (en) | 2005-02-02 | 2006-11-21 | Perry Kaye | Scissors |
Also Published As
Publication number | Publication date |
---|---|
JPS5859863A (ja) | 1983-04-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4635165A (en) | Printed-circuit construction with EPROM IC chip mounted thereon | |
JPS6223674B2 (en]) | ||
JP2801810B2 (ja) | 樹脂封止型半導体装置 | |
JPS63179764A (ja) | 感熱記録ヘツド | |
JPS5938075A (ja) | サ−マルヘツド | |
JPH07321160A (ja) | 半導体装置 | |
JP2817712B2 (ja) | 半導体装置及びその実装方法 | |
JPH09232366A (ja) | 半導体チップの実装装置及びその実装方法 | |
JP2554040Y2 (ja) | 電子部品取付構造 | |
JPS63205249A (ja) | 感熱記録ヘツド | |
JPH01196132A (ja) | 集積回路装置 | |
JPH0688420B2 (ja) | サーマルヘッド | |
JP3203157B2 (ja) | 混成集積回路装置 | |
JP3248117B2 (ja) | 半導体装置 | |
JPH06101493B2 (ja) | プラスチツクチツプキヤリア | |
JPH0739244Y2 (ja) | 混成集積回路装置 | |
JP2914679B2 (ja) | 混成集積回路装置 | |
JP2561409B2 (ja) | 感熱記録素子 | |
JPS6228260A (ja) | サ−マルヘツド | |
JPS6239036A (ja) | ハイブリツドic | |
JPS5879741A (ja) | 集積回路装置の接続方法 | |
JPH0142345Y2 (en]) | ||
JP2786047B2 (ja) | 樹脂封止型半導体装置 | |
JP2680969B2 (ja) | 半導体記憶装置 | |
JPH04126858U (ja) | 厚膜型サーマルヘツド |